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  Holo/Or end of the year 2020 discounts are he
ㆍ작성자: 전재필 ㆍ작성일: 2020-11-09 (월) 09:23 ㆍ조회: 15



NEWSLETTER - Q4 2020


 

Announcements

 

After more than 30 years in the business, Holo/Or has gained a new affiliate sister company - high quality laser scan system manufacturer SCANLAB GmbH. Being recently partly acquired, Holo/Or is now a part of the TechInvest Holdings Group. We are very excited to announce this partnership, and see positive collaborations in the upcoming future. For more details read here

 

Upcoming Events

 

Adjustable ring generator for laser welding applications - Webinar

 

Laser welding is used in a wide range of industrial applications including automotive, aerospace, batteries and many others.  A process-specific tailored laser intensity distribution can improve throughput, seam height, strength, and the edge smoothness of the joints.

Holo/OR has developed a method to combine the accuracy of passive DOE shaping with the versatility of active methods. Holo/Or's adjustable beam shapers can offer shaping such as a ring with central bright spot, where the ratio between ring and center can be adjusted by a simple movement of the beam on the element. 

Join us Nov. 17th to see this new component in action!

 


Schematic sketch of a laser head with an integrated DOE shaper with manual x stage. Left DOE region shapes the incident beam into a ring, while the right shapes into a central round spot. Moving the element in the x axis changes the power ratios between the ring and center spot
 

 

Laser Surface Texturing with single Beam splitter DOE as an alternative method to DLIP -Webinar

 


Patterning the surfaces of different materials by laser surface texturing (LST) has great economic and ecological potential.

One of the most promising methods to achieve LIPSS (laser induced periodic surface structures) is by direct laser interference writing (DLIP). However, a typical setup for DLIP contains multiple elements and is highly sensitive to tolerances. 

 


Holo/Or has developed a novel family of beam splitters that enables one to achieve DLIP like structuring results with a single DOE and a focus lens, with no sensitivity to tolerances and a compact, industry compatible design. 

 

Fig.1: 51x51 spots generated from a single multispot DOE with continuous modulation of intensity similar to DLIP
Fig.2: 1 dimensional zoom on intensity level along axis

 

Join us Dec 8th  for a presentation of the new component!

Both events will be presented by Holo/Or’s CTO Mr. Natan Kaplan, will be hosted by EPIC members product release and will include explanations and a Q&A session.

 

New Products

 

DeepCleave™ optical module for Laser filamentation Glass Cutting is expanding

 


Due to customer demand, we have expanded our standard DeepCleave Modules selection to cover ultra-thin glass cutting with a depth of focus as low as 0.25mm in air.

 

DeepCleave™ transforms a Gaussian laser beam into constant peak power along the entire depth of focus, optimized to increase throughput by preventing energy waste below the process threshold and enabling full depth filamentation glass cutting from a single pulse. DeepCleave™ is designed to easily integrate with any existing opto-mechanics. Each DeepCleave™ module is shipped out of our factory with a full optical characteristics and individual testing report.

Functional properties include:
• Depth of Focus range (can be customized): 0.25mm-2mm
• Spot size (along entire depth of focus): < 2um
• Z-axis Flat-top with constant peak power along DOF
• Complete optical solution with no need for additional high NA objectives
• Module dimensions: dia. 30.5mm x length 106mm

Watch DeepCleave™ recorded webinar held on Oct 14th ,2020

See standard products and learn more

 

Polymer on glass beam shaping – performance envelope increased!